Aehr Receives Order From New Customer For FOX-NP Multi-wafer Test & Burn-in System

Republished By Plato

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3 April 2024

Semiconductor production test and reliability qualification equipment supplier Aehr Test Systems of Fremont, CA, USA has received an initial customer order for a FOX-NP wafer-level test and burn-in system, multiple WaferPak Contactors, and a FOX WaferPak Aligner to be used for engineering, qualification and small-lot production wafer-level test and burn-in of their silicon carbide devices.

The customer is a multi-billion-dollar per year global semiconductor company with locations across Europe, Asia and the Americas that serves various industries including automotive, industrial, mobile and consumer applications. The FOX-NP system, including the FOX WaferPak Aligner and initial WaferPaks, are scheduled to ship over the next few months.

The FOX-NP system is configured with the new Bipolar Voltage Channel Module (BVCM) and Very High Voltage Channel Module (VHVCM) options that enable new advanced test & burn-in capabilities for silicon carbide power semiconductors using Aehr’s proprietary WaferPak full-wafer Contactors.

“After working with the Aehr team and our technology solutions over an extended period of time, they [the customer] felt secure in our ability to aid them in achieving these goals,” says president & CEO Gayn Erickson. “A key feature in their selection of our FOX solution is its proven ability to cost-effectively implement their target burn-in and stabilization requirements, including 100% traceability and proof that every device on the wafer is burned in for the needed test duration,” he adds.

“This customer currently has a wide range of automotive products and is entering the silicon carbide market to address several applications that include automotive, industrial and electrification infrastructure. Key capabilities of our solution include our ability to scale from engineering and qualification and small-lot production with the FOX-NP system to large-scale production with the FOX-XP with Automated WaferPak Aligner. They have told us that they plan to transition to our FOX-XP multi-wafer test and burn-in systems for high-volume production. Aehr’s FOX-P technology facilitates a seamless transition from engineering to high-volume production with 100% compatibility between systems,” he adds.

“This customer sees the enormous opportunity for silicon carbide power devices in industrial and power applications. William Blair forecasts that, in addition to the 4.5 million six-inch-equivalent wafers that will be needed to meet the demand for electric vehicle-related silicon carbide devices in 2030, another 2.8 million wafers are needed to address industrial, solar, electric trains, energy conversion and other applications in 2030. The cost of ownership of our solution proves to be more cost-effective and efficient for these devices than package part burn-in after the die are packaged. This is a strong testimony of the advantage of wafer-level burn-in as a better alternative to package part burn-in,” Erickson continues.

“The FOX family of compatible systems including the FOX-NP and FOX-XP multi-wafer test and burn-in systems and Aehr’s proprietary WaferPak full-wafer contactors provide a uniquely cost-effective solution for burning in multiple wafers of devices at a single time to remove early-life failures of silicon carbide devices, which is critical to meeting the initial quality and long-term reliability of the automotive, industrial and electrification infrastructure industry needs.”

The FOX-XP and FOX-NP systems, available with multiple WaferPak Contactors (full-wafer test) or multiple DiePak Carriers (singulated die/module test) configurations, are capable of functional test and burn-in/cycling of devices such as silicon carbide and gallium nitride power semiconductors, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, micro-controllers, and other leading-edge ICs in either wafer form factor, before they are assembled into single- or multi-die stacked packages, or in singulated die or module form factor.

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Tags: Semiconductor test instrument

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